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! Note ? Please read rating and ! CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
? This catalog has only typical speci?cations. Therefore, please approve our product speci?cations or transact the approval sheet for product speci?cations before ordering.
P50E.pdf
Sep.19,2012
Notice
c CERAFIL r 10.7MHz Chip Type SFECV/SFECK Series
o Soldering and Mounting
1. Standard Reflow Soldering Conditions
(1) Reflow
Filter is soldered twice within the following temperature
conditions.
240
Peak
(240°C max.)
230
Heating
Pre-heating
(230°C)
100
(150-180°C)
Gradual
Cooling
30 sec.
min.
60-120 sec.
30 sec.
max.
120 sec.
min.
(2) Soldering Iron
Filter is soldered at +350±5°C for 3.0±0.5 seconds. The
soldering iron should not touch the filter while soldering.
(3) Conditions for Placement Machines
The component is recommended for use with placement
machines that employ optical placement capabilities.
Damage may result from excessive mechanical force.
Please make sure that you have evaluated by using
placement machines before going into mass production.
Do not use placement machines that utilize mechanical
positioning. Please contact Murata for details beforehand.
(4) Other
(a) The component may be damaged if excess
mechanical stress is applied to it mounted on the
printed circuit board.
[Component Direction]
Put the
component
(b) Design layout of components on the PC board to
minimize the stress imposed on the warp or flexure of
the board.
(c) After installing components, if solder is excessively
applied to the circuit board, mechanical stress will
[Component Layout Close to Board]
lateral to the
direction in
which stress
acts.
cause destruction resistance characteristics to
Perforation
B
Susceptibility to
degrade. To prevent this, be extremely careful in
determining shape and dimension before designing
A
Slit
C
stress is in the order
of : A>C>B
the circuit board diagram.
(d) When the positioning claws and pick-up nozzle are
worn, the load is applied to the components while
positioning is concentrated to one positioning
accuracy, etc. Careful checking and maintenance are
necessary to prevent unexpected trouble.
(e) When correcting components with a soldering iron,
the tip of the soldering iron should not directly touch
the component. Depending on the soldering
conditions, the effective area of terminations may be
reduced. Solder containing Ag should be used to
prevent electrode erosion.
(f) Do not use strong acidity flux, more than 0.2wt%
chlorine content, in reflow soldering.
Continued on the following page.
55
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